Magnetron sputtering cluster CT200
The CT200 sputter cluster from Alliance Concept is an ultimate R&D system for magnetron sputter deposition of various inorganic thin films.
Sputter cluster CT200
Key specifications of CT200
- Three deposition chambers connected by transfer chamber with robotic arm
- Eight 250 mm diameter magnetrons
- Three 100 mm diameter magnetrons in confocal configuration for co-deposition
- DC-, pulsed DC and RF-sputtering modes in both inert and reactive atmosphere
- Optical emission monitoring for stable sputter process
- Rotatable substrate holder that can be heated to 600 °C or cooled to -20 °C
- Deposition uniformity +/-2.5% for substrates up to 100x100 mm2
- Separate de-gassing and storage chamber
Possible materials
- Metals (Mo, Ti, Cu, W, Si, etc.)
- Metal oxides including transparent conducting oxides (SiO2, ITO, ZnO, In2O3, etc.)
- Metal nitrides (TiN, Si3N4,…)
- Metal sulfides (ZnS, CdS, …)
Sputtering systems available at Empa
Several sputter systems are available at Empa labs for R&D of various inorganic layers on both rigid and flexible substrates. You can find more information on the following pages:
