• Glow Discharge Optical Emission Spectrometer (GD-OES), JY RF-5000
• X-Ray Diffractometer 2theta/theta, Bruker D8 Discover (Bragg Brentano and parallel beam setup, copper tube, Eulerian cradle)
  For Phase Identification, Grain Size, Grazing Incidence, X-Ray Reflectometry, Stress, Texture
• X-Ray Fluorescence Spectrometer Fischerscope X-Ray XDV-SDD
• Confocal Raman spectroscopy (NTEGRA Spectra from NT-MDT), Raman Mapping, Lasers: He-Ne (633 nm) and solid state (532 nm), Objectives : 10x, 50x, 100x, 250x, Spectral Resolution: <0.5 cm-1
• Balance Mettler PM 2500 MultiRange with addition for densities
• High spatial resolution gallium ion secondary ion mass spectrometer, integrated with Tescan Lyra focused ion beam instrument - see below
• Contact and non-contact AFM, Phase Imaging, EFM/KFM, AFM and KFM Lithography, XYZ-scanning by sample (closed-loop)
• Coupling AFM/Raman, XY-scanning by excitation laser beam (closed-loop)/Piezo-driven mirror for scanning the apex of the tip with the incident beam
• Leica EMTIC3x Ionslicer
• Leica EMCPD300 Critical Point Dryer
• Leica EMACE600 Sputtlecoater (Gold, Carbon)
• Leica EMTXP sample preparation

FEI Titan Themis 200 (ThermoFisher)

• X-FEG high brightness electron source
• Cs DCOR Probe Corrector 200 kV
• STEM imaging: High Angle Annular Dark Field detector (HAADF) with OptiSTEM software
• Super-X EDX System
• Ceta 16M Camera 200 kV with speed enhancement (4k x 4k STEM imaging with 40 fps; 512x512 with 320 fps)
• CompuStage Single-tilt Holder; High-visibility Low-background Double-tilt Holder
• Velox Analytical and Imaging softwares

High resolution cold field emission SEM Hitachi S-4800 (CFE)

• STEM detector zu S-4800
• EDX system EDAX Genesis 4000
• EBSD DigiView II camera. EDAX OIM software (V5.3.1)
• Hysitron Picoindenter

Large Chamber, variable pressure SEM Hitachi S-3600VP

• • XENOS e-beam lithography software
  • external and internal gas injection system for direct patterning
  • high temperature stage
  • stage current monitoring
  • SEM compatible femtogram mass sensor

Large Chamber SEM, SEM Zeiss DSM96

• Micro tensile stage for SEM and light microscope
• Micro bending stage for SEM and light microscope, Kammrath und Weiss
• home-made Microindenter
• Heating stage

Tescan Lyra/XMU Dual beam FIB

• YAG SE detector
• Retractable annular scintillator type BSE (YAG Crystal)
• Fully motorized stage
• Variable pressure mode for SEM
• 4-d Nanomanipulator using slip-stick piezos from SmarAct
• Gas injection system using slip-stick piezos from SmarAct
• Time-of-Flight Mass Spectrometry (TOFMS)

Tescan Lyra3/XMU FEG/FIB

• YAG SE detector
• Retractable annular scintillator type BSE (YAG Crystal)
• Retractable CL Detector Panchromatic cathodoluminescence detector 185 nm – 850 nm
• Fully motorized stage
• Variable pressure mode for SEM
• STEM Detector Transmitted electrons detector; Bright Field and Dark Field imaging
• EBIC Electron beam induced current detection
• Time-of-Flight Mass Spectrometry (TOFMS)
• EBSD DigiView 5 camera. EDAX OIM software
• EDS Octane Plus Silicon Detector (SDD). EDAX TEAM software
• WDS TEXS HP from EDAX
• XRF IFG iMOXS-SEM with polycapillary mini-lens (Rh source)
• Tuning fork AFM dedicated for measurements in vacuum (In-house build, in collaboration with Specs)

Philips XL30-FEG ESEM

• Div detectors

Hitachi 3030Plus TableTop Electronmicroscope

• CSM Nanointenter (Vacuum high temperature)
• MTS Nanoindenter XP (Indentation & Scratch & Mikrokompression)
• CSEM Nanohardness & Nanoscratch Tester (Indentation & Scratch)
• Micro tensile stage for SEM and light microscope, Kammrath und Weiss
• Micro bending stage for SEM and light microscope, Kammrath und Weiss
• home-made SEM Microindenter for SEM and light microscope
• Hardness test instruments: Universal Hardness Zwick HU2,5, Vickers, Brinell

• Autolab analytical potentiostats (including ac impedance module) and current booster (up to 20A)
• Computer controlled 6 kW power source
• Variety of electrochemical cells and reference electrodes
   
• Rotating propeller MEMS plating cell and Hull cell
• PH meter
  • Conductivity meter
  • Titration devices
  • CVS devices
  • Comsol FEM module plating/anodization
  • One glove box
  • Rapid Thermal annealing system

PVD chamber #1 (Mantis QPREP 500)

ALD-PVD multilayer adhesion studies without breaking the vacuum

Deposition techniques

• Three inch magnetrons for sputtering with RF and DC power sources
• E-beam assisted thermal evaporator with four independent pockets
• Shutter system for gradient depositions or patches

Loadlock features

• Chamber-in-chamber design with exhaust for ALD/CVD processes
• Dual heaters up to 250^o C
• Six precursor lines, currently configured for Al₂O₃ and ZnO

Main chamber features

• Quartz crystal balance
• Substrate stage heating to 800^o C
• Automated loadlock and sample transfer for multilayers
• Secondary MFC for reactive sputtering

PVD chamber #2 (Mantis M 600)
Studying the effect of nanoparticles and pulsed DC plasma

NanoGen 50 Nanoparticle source

• MesoQ quadrupole mass spectrometer for mass filtering and size control

One 2 inch and one 3 inch magnetron

• 2x HiPIMS sputter sources, plus RF and DC
• Adjustable magnetron distance for very high deposition rates
• Custom magnet sets for plasma density control

Main chamber features

• UHV design for plasma science
• Viewports for optical inspection of plasma in transmission and reflection
• Crygogenically cooled panels for extreme low base pressure
• Substrate stage heating to 800^o C
• Loadlock for manual sample transfer
• Secondary MFC for reactive sputtering
   

PVD chamber #3 (Polygnon Physics)

• Novel mini ECR plasma sputter source
• Up to 24 sources in simultaneous operation
• Reactive sputtering possible

Specifications

• Class 10.000 or ISO 7
• 35 m² clean space and 10 m² grey zone
• Yellow light filtration for photosensitive materials
• All exposure equipment interoperable at 365 nm (I-line)

Equipment

• Nanoscribe Photonic Professional GT
  Two-photon 3D lithography with resolution down 100 nm
• Karl Süss MA-6
  4 inch contact aligner with 1 um resolution
• IMP SF-100
  Fast prototyping maskless dot matrix printer with 15 um resolution
• Full LiGA mold and 2D/3D photoresist processing line
  Various spincoaters and baking stations

• The Mantis PVD chamber load lock was modified to contain an ALD chamber with 6 gas inlets to coat PVD nanoparticles and thin PVD layers without breaking the vacuum.
• ALD load lock: 6 inch wafer, Materials: Oxide coatings, like Al2O3, ZnO, TiO2.
• PVD: High vacuum chamber with a nanoparticle gun, e-beam evaporation and DC & RF magnetron sputtering. Materials: metals, nitrides, oxides, multilayers, combinatorial

Custom made stationary ALD reactor

• 3 gas inlet lines. Temperatures up to 240°C. Al₂O₃, ZnO, TiO₂, SiO_2, CeO₂, etc.

• Modifiable to use O₃ and O₂ plasma

• 4 inch wafer size, 3 cm thick samples

• Full control over temperature and variable cycle/purge/exposure periods as function of total cycle number

• Integrated novel Temperature Step ALD [C. Guerra, H.G. Park, I. Utke et al., Nanoscale (2015) DOI: 10.1039/c5nr02106e]

Mobile ALD

• Autonomous and can be transported to any location as it is installed on a rack. It has a 3+ valve manifold line to connect to any reactor or characterization equipment for in-situ ALD measurements.

• Reactors used so far: Flow through reactor for fast ALD on porous membranes and powders.

• Mini reactor for in-situ Raman studies of initial ALD stage

Arradiance Benchtop ALD

• This commercial system is designed in a compact way to allow for precursors with low vapour pressures to enable off-standard oxide, metal, and fluoride film materials. It is suitable for 6 inch wafers and heats to 300°C

• Equipped with a  QCM it allows for in-situ control of initial growth during ALD as well as growth monitoring

• It also features a glove box connection for ALD on moisture and air sensitive samples