Joining Technologies

We offer product-oriented solutions for the joining of complex material systems, from large structures to miniaturized components, including

  • Microelectronics and sensor technology

  • Photonics

  • Watch, tool and automotive industry

  • Aerospace and space applications

To this end, we are continuously developing new material and process technology concepts (see Research on Advanced Joining and Nano- & Micro-Joining).

RECENT APPLICATION EXAMPLES

   

Joining technologies for
(aero-) space applications

 

Sintering with
nanopastes   

  

Brazing of tools
         
   

Hybrid brazing solutions

  

Reactive joining

 
Transient-liquid phase bonding

OUR PORTFOLIO

  • Consulting, failure analysis, feasibility studies, prototype development, research and development projects with industrial partners (e.g. Innosuisse), brazing and soldering of small product series

  • Vacuum brazing, gas-shielded brazing and soldering, transient liquid phase bonding, sintering with nano-pastes, reactive joining, hybrid joining processes (coating and brazing), micro- and nanojoining

  • Joint design, residual stress control, surface engineering and interface optimization

  • Mechanical, thermal and chemical integrity (corrosion) of joints

INFRASTRUCTURE

  • Manual Flip-Chip-Bonder (Fineplacer ® pico ma)

  • Wetting angle furnace up to 1000 °C (DSAHT12)

  • Vacuum furnace SCHMETZ type E80/1H

  • Vacuum furnace CVE HL 1218

  • DSC NETZSCH 404C

  • Universal testing machine SHIMADZU AGS-X 100 kN

  • Shear testing machine Walter+Bai STM 20

  • Micro hardness tester FISCHERSCOPE HM 2000

  • REM/EDX HITACHI S-3700

  • X-ray diffraction (XRD)

  • Local electrochemistry

  • Surface analysis (XPS, AES, AFM)

joining technologies, joining, packaging, assembly, brazing, soldering, bonding, diffusion bonding, transient liquid phase bonding, TLP, nanopaste, nanopaste sintering, nanopaste bonding, reactive joining, filler, nanofiller, foil, nanofoil, nanomultilayer, solder, braze, surface coating, metallization, metal-ceramic, joint assembly, nanojoining, microjoining, packaging, integration, flip-chip bonding, die bonding, reflow, nanopaste, reactive joining, flip-chip bonding, die bonding, reflow, research, service, advise, consult
joining technologies, joining, packaging, assembly, brazing, soldering, bonding, diffusion bonding, transient liquid phase bonding, TLP, nanopaste, nanopaste sintering, nanopaste bonding, reactive joining, filler, nanofiller, foil, nanofoil, nanomultilayer, solder, braze, surface coating, metallization, metal-ceramic, joint assembly, nanojoining, microjoining, packaging, integration, flip-chip bonding, die bonding, reflow, nanopaste, reactive joining, flip-chip bonding, die bonding, reflow, research, service, advise, consult
joining technologies, joining, packaging, assembly, brazing, soldering, bonding, diffusion bonding, transient liquid phase bonding, TLP, nanopaste, nanopaste sintering, nanopaste bonding, reactive joining, filler, nanofiller, foil, nanofoil, nanomultilayer, solder, braze, surface coating, metallization, metal-ceramic, joint assembly, nanojoining, microjoining, packaging, integration, flip-chip bonding, die bonding, reflow, nanopaste, reactive joining, flip-chip bonding, die bonding, reflow, research, service, advise, consult

Your contacts

Prof. Dr. Jolanta Janczak-Rusch
Group Leader

Phone: +41 58 765 4529

Dr. Bastian Rheingans
Scientist (Deputy Group Leader)

Phone: +41 58 765 4371