Physical Vapor Deposition (PVD)
Physical Vapor Deposition (PVD) is a group of deposition processes to controllably prepare thin films. Evaporation and magnetron sputtering, including HiPIMS, are the most important technologies. The use of plasmas makes these techniques powerful tools to specifically design the properties of deposited thin films.
![https://www.empa.ch/documents/147354/601833/IMG_0421_570px.jpg/15220332-bd31-4394-989b-d7238a77320f?t=1467639962000&doAsUserId=mLYofz1ofIc4z2qdMCjTcg%3D%3D%3F_NewsPortlet_categoryId%3D56975](https://www.empa.ch/documents/147354/601833/IMG_0421_570px.jpg/15220332-bd31-4394-989b-d7238a77320f?t=1467639962000&doAsUserId=mLYofz1ofIc4z2qdMCjTcg%3D%3D%3F_NewsPortlet_categoryId%3D56975)
PVD technologies and installations
A number of different installations exist in the Coating Competence Center as well as in several other Empa labs using technologies like ...
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