• Nondestructive evaluation
• Battery testing
• Measuring devices for electrical characterization
• Wafer Prober / Imina Prober
• Power Electronic tester 

General

• Defect analysis / failure analysis
• Monitoring und Labor automation (HW/SW)
• Environmental chambers (Testkammern mit korrosiver Atmosphäre)

Mechanics

• Laser ablation
• Deformation, Strain and Modal Analysis
• Strain measurement using Resistive Strain Gauges

Microscopes

• X-Ray microscope
• Gallium FIB
• Helium FIB
• Electron microscope
• EMMI/OBIRCH equipment

Optics

• 2/3D-optical technology
• Raman Spectroscopy
• THz Holography
• Twyman-Green_interferometer
• Ellipsometer
• Speckle pattern interferometer (DSPI/ESPI)
• THz equipment

Physics

• Cryo (ARS Cryo 4k, Heliox VL, Lake Shore)

Software Development / Laboratory Automation

• LabVIEW software development
• FPGA software development (VHDL)
• Support of selecting hardware components for measurement and automation tasks (Motor stages, Cameras, DAQ systems, Sensors ...)
• Creating LabVIEW device drivers for 3rd party hardware components (DLLs, .NET, ActiveX ...)
• Device communication (Serial, Ethernet, CAN, GPIB ...)
• Image Acquisition & Processing

Thermal Methods

• Temperature measurement
• IR-technology

Ultrasonics

• Ultrasonic imaging: liquid immersion technique and air-coupled ultrasound
• Ultrasonic contact technique
• Ultrasonic software: data acquisition and evaluation; simulation of wave propagation
• Elastic properties
• Ultrasonic Localization of Flaws in Base Materials
• Ultrasonic Localization of Flaws in Joined Materials
• Surface Topography with Ultrasound
• Ultrasonic Thickness Measurement